| 000 | 01406cam a22004097i 4500 | ||
|---|---|---|---|
| 001 | 18386638 | ||
| 003 | OSt | ||
| 005 | 20210930191936.0 | ||
| 008 | 141125s2014 maua d 001 0 eng d | ||
| 010 | _a 2014469441 | ||
| 015 |
_aGBB0A4559 _2bnb |
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| 016 | 7 |
_a015639217 _2Uk |
|
| 020 | _a9780815515937 | ||
| 020 | _a0815515936 | ||
| 035 | _a(OCoLC)ocn660539201 | ||
| 040 |
_aUKM _beng _erda _cUKM _dBTCTA _dYDXCP _dIQU _dDLC |
||
| 042 | _alccopycat | ||
| 050 | 0 | 0 |
_aTS695 _b.S275 2014 |
| 082 | 0 | 4 |
_a621.381 _222 |
| 100 | 1 |
_aSarkar, Jaydeep _c(Materials scientist) |
|
| 245 | 1 | 0 |
_aSputtering materials for VLSI and thin film devices / _cJaydeep Sarkar. |
| 264 | 1 |
_aWaltham [Mass.] : _bWilliam Andrew, _c2014. |
|
| 300 |
_ax, 603 pages : _billustrations ; _c25 cm |
||
| 336 |
_atext _btxt _2rdacontent |
||
| 337 |
_aunmediated _bn _2rdamedia |
||
| 338 |
_avolume _bnc _2rdacarrier |
||
| 504 | _aIncludes bibliographical references and index. | ||
| 650 | 0 |
_aMicroelectronics _xMaterials. |
|
| 650 | 0 |
_aCathode sputtering (Plating process) _xMaterials. |
|
| 650 | 0 |
_aIntegrated circuits _xVery large scale integration _xMaterials. |
|
| 650 | 0 |
_aThin film devices _xMaterials. |
|
| 650 | 0 |
_aFlat panel displays _xMaterials. |
|
| 650 | 0 | _aSputtering (Physics) | |
| 906 |
_a7 _bcbc _ccopycat _d2 _encip _f20 _gy-gencatlg |
||
| 942 |
_2lcc _cBK |
||
| 999 |
_c2142 _d2142 |
||