Electroless copper and nickel-phosphorus plating [electronic resource] : processing, characterisation and modelling / W. Sha, X. Wu and K.G. Keong.

By: Contributor(s): Material type: TextTextPublication details: Cambridge : Woodhead Pub., 2011.ISBN:
  • 9780857090966 (ebook)
Subject(s): Genre/Form: LOC classification:
  • TS662 .S53 2011eb
Online resources:
Contents:
pt. 1. Electroless copper depositions -- pt. 2. Electroless nickel-phosphorus (Ni-P) depositions.
eBook - Materials and Engineering 2009 - 2011 (Woodhead migration) [EBCWME11]
Tags from this library: No tags from this library for this title. Log in to add tags.
Star ratings
    Average rating: 0.0 (0 votes)
Holdings
Item type Current library Call number Status Date due Barcode
Books Books Kwara State University Library TS 662 .S52 2011 (Browse shelf(Opens below)) Available 008469-01
Books Books Kwara State University Library TS 662 .S52 2011 (Browse shelf(Opens below)) Available 008469-02

Includes bibliographical references and index.

pt. 1. Electroless copper depositions -- pt. 2. Electroless nickel-phosphorus (Ni-P) depositions.

License restrictions may limit access.

There are no comments on this title.

to post a comment.