Reliability and failure of electronic materials and devices / Milton Ohring with Lucian Kasprzak.
Material type: TextPublisher: Amsterdam ; Boston : Elsevier/Academic Press, [2015]Edition: Second editionDescription: xxiv, 734 pages : illustrations ; 24 cmContent type:- text
- unmediated
- volume
- 9780120885749 (hardback)
- 621.381 21
- TK7870.23 .O37 2015
Item type | Current library | Call number | Status | Date due | Barcode | |
---|---|---|---|---|---|---|
Books | Kwara State University Library | TK7870.23 .O47 2015 (Browse shelf(Opens below)) | Available | 015224-01 | ||
Books | Kwara State University Library | TK7870.23 .O47 2015 (Browse shelf(Opens below)) | Available | 015224-02 | ||
Books | Kwara State University Library | TK7870.23 .O47 2015 (Browse shelf(Opens below)) | Available | 015224-03 |
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Includes bibliographical references and index.
An Overview of electronic devices and their reliability -- Electronic devices: how they operate and are fabricated -- defects, contaminants, and yield -- Mathematics of failure and reliability -- Mass transport-Induced failure -- Electronic charge-induced damage -- Environmental damage to electronic products -- Packaging materials, processes, and stresses -- Degradation of contacts and package interconnections -- Degradation and failure of electro-optical materials and devices -- Characterization and failure analysis of materials and devices --Future directions and reliability issues.
"Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices"-- Provided by publisher.
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